220033, Republic of Belarus, Minsk, Partizansky Prospekt, 2-1a, office 206A
Tel. +375 (29) 621 79 05
E-mail: planarso@kbtem.by
This machine is designed for assembling power electronic components on multi-chip microassemblies and in discrete device packages. Leads made of aluminum tape and thicker-gauge wire are joined using the ultrasonic wedge-to-wedge welding method. A welding head with vertical wire (tape) feed allows for lead joining in the confined spaces of multi-chip microassemblies, with a penetration depth of up to 35 mm. Separation of the aluminum wire (tape) is achieved using a cutter with a controlled notch and an ultrasonic pulse. This, combined with the soft contact of the contact pads, enables lead joining using either the die-to-crossarm, crossarm-to-die, or die-to-die configurations.