220033, Republic of Belarus, Minsk, Partizansky Prospekt, 2-1a, Office 206A
Tel. +375 (29) 621 79 05
E-mail: planarso@kbtem.by
The EM-6080 probe testing system is designed to establish electrical contact between the customer's measuring circuits and the contact pads of integrated circuit chips on semiconductor wafers. The maximum diameter of the tested wafers is 200 mm. Die size, mm: from 0.4 x 0.4 to 20 x 20. Power consumption, kW: no more than 0.8. The system's electronics and software allow for on-site retraining for a different product, while maintaining the system's parameters for operation in multi-product manufacturing environments.